Encapsulation
Cure with LED or UV/Visible light
Fast, tack free cure in seconds
Secondary heat or moisture cure available
One part formulation - no mixing
Optically clear, no yellowing
Solvent free
Resistant to humidity and thermal shock
Electrically insulating
Room temperature ship and storage
Protect microelectronic components with Dymax light-curable PCB encapsulants. The encapsulation materials cure in seconds when exposed to UV/Visible light and provide superior protection of flexible and rigid PCB platforms. Chip encapsulants also have excellent adhesion to flex circuit substrates such as polyimide and PET.
Additionally, LED encapsulation materials are available and are resistant to heat-induced yellowing and are optically clear. 