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Camera Module Assembly
Cure with LED or UV/Visible light
Complete cure in seconds
Withstand moisture, heat, and shock
One part formulations - no mixing or diluting
Solvent free
Excellent adhesion to glass, Kapton, PMMA, ceramic, silicon, lead frame, flex circuit, FR-4, ABS, LCP
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Conformal coating
Cure with LED or UV/Visible Light
Complete cure in seconds
Excellent adhesion to glass, Kapton, PMMA, ceramic, silicon, lead frame, flex circuit, FR4, ABS, and LCP
Withstand moisture, heat and shock
One part formulation - no mixing or diluting
Solvent free
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Encapsulation
Cure with LED or UV/Visible light
Fast, tack free cure in seconds
Secondary heat or moisture cure available
One part formulation - no mixing
Optically clear, no yellowing
Solvent free
Resistant to humidity and thermal shock
Electrically insulating
Room temperature ship and storage
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Optical display bonding
Cure with LED or UV/Visible light
Complete cure in seconds
Non-yellowing for increased light transmission, enhanced brightness, optical clarity, and better contrast ratios
Excellent bond strength
Superior re-workability for easy removal or repair
Easy flow characteristics for flat panel lamination
Excellent thermal shock resistance
Low shrinkage minimizes visible distortion after cure
Reduces entrapment and bubbles for ripple-free bonds
Solvent free
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Peeable Maskant
Cure with LED or UV/Visible light
Complete cure in seconds
Residue free upon removal
One part formulation - no mixing
Solvent free
Silicone free
Replace tape, wax and lacquer waxing methods
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Potting Compounds
Cure with LED or UV/Visible light
Full cure in 10-30 seconds
Increased manufacturing floor space
Lower inventory costs
Replace epoxy and silicone materials
Halogen-free formulations available
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Thermal Interface
Cure with LED or UV/Visible light
Instant fixture for immediate movement to next process
High viscosity and highly thixotropic properties
Halogen-free formulations available
Remain in place prior to part being mated
Long-term reliability
No heat exposure required
Minimal expansion during thermal rise
No refrigeration necessary
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Wire Tacking and Component Ruggedizing
Cure with LED or UV/Visible light in seconds
Enhance shock and vibration resistance of electronic assemblies
Highly thixotropic for zero movement prior to cure
Low modulus for minimal stress in component interfaces
Easy rework – no residue on solder pads or between solder balls
Available with See-Cure Technology to confirm complete cure
Exhibit improved bond strength for die and pry testing
Halogen & silicone free
RoHS Compliant
others
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Links
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Browsing site by scanning QR Code
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