Thermal Interface

Cure with LED or UV/Visible light
Instant fixture for immediate movement to next process
High viscosity and highly thixotropic properties
Halogen-free formulations available
Remain in place prior to part being mated
Long-term reliability
No heat exposure required
Minimal expansion during thermal rise
No refrigeration necessary

Dymax thermally conductive adhesives are ideal for mounting heat sinks and heat-sensitive electronic components to printed circuit boards, eliminating the need for mechanical fasteners and clips. Multi-Cure^® thermal adhesives provide an efficient method of thermal transfer between heat sinks and electronics. The products cure in seconds with light, heat, or activator. Light-cure allows for exposed areas to cure immediately, fixturing parts in place so activator or heat can continue curing in shadowed areas without interruption to process flow.