Wire Tacking and Component Ruggedizing
Cure with LED or UV/Visible light in seconds
Enhance shock and vibration resistance of electronic assemblies
Highly thixotropic for zero movement prior to cure
Low modulus for minimal stress in component interfaces
Easy rework – no residue on solder pads or between solder balls
Available with See-Cure Technology to confirm complete cure
Exhibit improved bond strength for die and pry testing
Halogen & silicone free
RoHS Compliant
Stake, fix, hold, and reinforce critical components on printed circuit boards with light-curing adhesives. Wire tacking and ruggedizing adhesives cure in seconds upon exposure to UV/Visible light energy to provide optimal protection of printed circuit board components. The “on-demand” cure makes them ideal for manual applications such as edge bonding and reinforcement, where precise placement and immediate strength is critical.
Dymax materials hold vital components on PCBs, such as Ball Grid Arrays (BGA) and Video Graphics Arrays (VGA), and are designed for secondary processes or for long-term reliability.
Typical applications include and held electronic devices, mobile phones, laptop computers, gaming consoles, GPS (global positioning systems), and digital music players.
